Qualcomm is pushing out XR2 chips faster than VR headsets can use them - Simor Blog

Qualcomm is pushing out XR2 chips faster than VR headsets can use them

AnĂșncios

What you need to know

  • Qualcomm is reportedly shipping new XR2 and XR2+ Gen 3 chips to VR HMDs.
  • These Project Matrix chips are said to support 16GB of RAM, UFS 4.0 storage, and 4K displays, and may use Oryon CPUs.
  • The Snapdragon XR2+ Gen 2 was announced in early January and has yet to appear in consumer products.

Qualcomm has reportedly begun testing and testing its Snapdragon XR2 Gen 3 and XR2+ Gen 3 chips designed for the next generation of VR headsets. This leaked news surprised us, given that a Gen 2 chip has yet to make its way into the hands of consumers.

WinFuture’s Roland Quandt first posted on X about Project Matrix, the company’s “next-generation AR/VR chips,” on May 17. Specifically, he explained how the higher-end SXR2350 will support 16GB of RAM, UFS 4.0 storage, and 4K displays.

AnĂșncios


#Qualcomm #pushing #XR2 #chips #faster #headsets
Image Source : www.androidcentral.com

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top